5 Key Factors to Ensure Precision in Stamping Die Manufacturing

5 Key Factors to Ensure Precision in Stamping Die Manufacturing 

Achieving micron-level precision in stamping dies requires strict control over five critical parameters:  

 1. Material Selection 
- Tungsten Carbide (ISO K10-K40):  
  With hardness up to HRA 92.5, it’s ideal for high-wear applications like electronic connector pin stamping.  
- Powdered High-Speed Steel (ASP® 30):  
  Suitable for complex geometries, offering HRC 64-66 hardness post-heat treatment.  

2. Surface Finish Optimization  
- Post-EDM Polishing Process:  
  - Rough Polishing: #400 diamond grinding wheels (Ra 0.4μm → 0.2μm).  
  - Fine Polishing: Chemical-mechanical polishing (CMP) achieves Ra <0.05μm.  
- Drow PG Series Dies:  
  Mirror polishing technology ensures consistent stamped part roughness below Ra 0.1μm.  

3. Thermal Management 
- Conformal Cooling Channels:  
  Maintain die temperature within ±2°C to minimize thermal deformation.  
- Case Data:  
  A customer producing smartphone metal casings increased die lifespan from 500k to 820k cycles.  

4. Tolerance Control
- Micro-Hole Machining:  
  Achieves ±0.002mm bore tolerance using 0.1mm-diameter micro-EDM electrodes.  
- Drow Kinyet Sub-Brand:  
  PG Punch Pins guarantee straightness of 0.001mm/100mm.  

5. Maintenance Protocols  
- Daily Checks:  
  Clean residual oil with pH-neutral solvents.  
- Monthly Calibration:  
  Verify flatness via laser interferometry (threshold: ≤0.003mm).  

Internal Links:  
- Case Study: `/en/stamping-die-case-study`  
- Whitepaper: `/en/surface-finish-standards`  
- Product Catalog: `/en/tungsten-carbide-dies`